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TvU High Temperature Alumina / Sapphire Bonding

High Temperature Alumina / Sapphire Bonding (2003)



Joining technique for sapphire to alumina or either ceramic to metal.  To 1000°C or 1400°C; can be vacuum tight joints.  The technology was developed by TVU with the initial sample assembled at Yale University.  (photo courtesy of Prof. David DeMille)
Contact Stephen Bates with questions or to discuss your application.
 

 

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Last updated:

March   2004