TvU High Temperature Alumina / Sapphire Bonding

High Temperature Alumina / Sapphire Bonding (2003)

Joining technique for sapphire to alumina or either ceramic to metal. To 1000°C or 1400°C; can be vacuum tight joints. The technology was developed by TVU with the initial sample assembled at Yale University. (photo courtesy of Prof. David DeMille)

Contact Stephen Bates (thought@tvu.com) with questions or to discuss your application.

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Last updated: July 2010